由于时间紧迫,所以我摘抄了一小段,请大家帮忙翻译一下,另外一部分我自己翻译,只是作业,虽然是下周交,但是我希望今天完成.谢谢大家,帮忙看一下,之前我曾把此文的另一部分放上.只是作业,不要求准确.再次麻烦了.高分送上,现在是早7点35分.我在线,我的qq165324631.
2.3　Supporting beam (beam 1) mode analysis
The major relevant modes of supporting beam
are shown in Fig 7. Those two modes denote the same and opposite vibration of supporting beam.The importance of those two modes lie in the fact that if resonant frequencies of those two modes approach the resonant frequency of the desirable mode, the vibration of DETF would result in the vibration of supporting beams and the quality factor of DETF would decrease sharply. However if the supporting beam is too rigid, the sensitivity of this design would be affected so that in order to
choose desirable structural parameter of Beam 1, a balance between quality factor and sensitivity should be considered.
Fig.7　FEA simulation of the major relevant mode of supporting beam3　FEA simulation
3.1　FEA simulation of the novel design
In this paper a group of optimized parameter
has been chosen based on above discussions. By means of adjusting the structural parameter of Beam 5, the resonant frequency of desirable mode is about 50 kHz so that it can withstand low-frequency disturbance and be much lower than the resonant frequency of supporting beams at the same time. By adjusting Beam 2, the resonant frequency of the first major disturbance mode is about 40 kHz and by adjusting Beam 6, the resonant frequency of the second major disturbance mode is less than 5 kHz. The parameter of beam 1 has been chosen so that the resonant frequency of supporting beam is more than 100 kHz. The result of FEA simulation asserts that the sensitivity of this structure is more than 1000 Hz/gnshown in Fig.8.
Fig.8　FEA simulation of the novel structure
3.2　FEA simulation of not perfectly matched DETF
If practical fabrication process is taken into consideration, two tines of the DETF probably cannot match each other perfectly. The practical verge of two tines of DETF would not be as smooth as they are thought to be after microfabrication because of existence of undercut of tines when DETF are in the process of DRIE. To simulate this situation, we assume that one tine of the DETF1 has smaller height than original design because of side-effect of etching while DETF2 is perfectly matched and the simulation of vibrating shape is shown in Fig.9. The major characteristic of this vibrating shape is that the amplitude of the Fig.9　Simulation of the unmatched DETF two vibrating tines of DETF1 is different largely due to stiffness difference of those two tines. What is more, because of stiffness difference, the resonant frequency of the DETF1 don’t agree with the resonant frequency of the perfectly matched DETF2 and the moments applied by two tines at the joint between beam2 and detf1 can not match each other so that there exists energy dissipation decreasing quality factor. The result of FEA simulation is shown in Fig. 10.

2.3　支承梁模态分析
支承梁的重要相关模态见图7，这两个模态表示支承梁的同向和反向振动。这两个模态的重要性在于：如果它们的共振频率接近所希望的共振频率， DETF的振动将导致支承梁的振动，而且DETF的质量因子会显著降低。 但是，如果支承梁的刚度太大，那么本设计的灵敏度将受到影响，从而为了给梁1选择合适的结构参数，应该考虑质量因子与灵敏度的合理平衡。
图7　支承梁主要模态的有限元模拟
3　有限元模拟
3.1　创新设计的有限元模拟

本文基于以上讨论选择了一组优化参数。通过调整梁5的设计参数，所求模态的共振频率为大约50千赫， 使其能够抵抗低频干挠且同时比支承梁的共振频率低很多。通过调节梁2，第一干挠模态主频的共振频率为大约40千赫；通过调节梁6，第二干挠模态主频的共振频率低于5千赫。通过选择梁1的参数使支承梁的共振频率高于100千赫. 有限元模拟结果指出，这一结构的灵敏度高于1000 Hz/gn，见图8.
图8　创新结构的有限元模拟
3.2　非完全匹配FDET的有限元模拟
如果考虑实际制造过程，那么DETF的两个分支可能不完全匹配。在DETF的DRIE过程中，由于切口的存在，在微制造以后，两分支的边缘可能并不像认为的那样平滑。为了模拟这种情况，我们假定DETF1的一个分支由于蚀刻负效应因而高度比原设计小，而DETF2则是完全匹配的，振型的模拟见图9.这一振型的主要特点是:DETF1两个分支的振幅明显不同，主要归于这两个分支的刚度不同,(图9. 非匹配DETF的模拟),更为甚者，由于刚度不同，DETF1的共振频率与完全匹配的DETE2的共振频率不一致，而且两个分支施加于梁2与DETF1联结点处的弯矩不能互相匹配， 以致此处存在降低质量因子的能量耗散。有限元模拟的结果见图10。